Give quality, process, equipment, test, and operations teams a shared intelligence layer for investigating risk and preventing production loss.
The five Rulnix modules are not separate applications — they operate as one connected system, passing evidence from detection through investigation to measured improvement.
Detects pressure instability in Etching Tool 4.
Identifies a new contact-defect pattern on inspection.
Predicts production loss for affected wafer lots.
Detects related chip failures at final test.
Identifies the probable root cause with evidence.
Engineers implement the corrective action.
Rulnix measures whether yield actually improved.
Engineers ask questions in plain language. Rulnix answers from live manufacturing data — with sources, confidence, and next steps attached. Every answer connected to manufacturing evidence.
Metrics below are illustrative — actual results depend on fab configuration and data maturity.